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Cantilever Memory

Apex is a leading manufacture of Ultra High Parallel / High Pin-Count cantilever probe cards for DRAM, NOR / NAND FLASH memory devices.

Fast delivery, flexible design and a wide operating temperature, provide customers with an economical probe solution for 1st Silicon Ramp, Wafer Burn-In and as well as full production.

The inherent design flexibility of cantilever probe cards make them well suited to accommodate a wide variety of pad layouts including LOC, DLOC and Edge types.

Product Summary

DRAM x64 (11 x 6) - Total Probes: 4,672

· Probe Array Size: . . . . . . . . Up to 6 DUT in (Y) Axis

· Minimum Pitch: . . . . . . . . . . 70 μm

· Row to Row Separation: . . . . 5 mm

· Test Speed: . . . . . . . . . . . . . . 50 MHz

· Alignment: . . . . . . . . . . . . . . +10μm

· Planarity: . . . . . . . . . . . . . . . +10μm

· Probe Force: . . . . . . . . . . . . . 1.5 ~ 2.5 g/mil O/T

· Operating Temperature: . . . - 40º ~ 125º C

· Tip Shape: . . . . . . . . . . . . . . . Flat, Semi Radius, Radius

· Probe Material: . . . . . . . . . . Tungsten (W),

Tungsten Rhenium (Wre)

Beryllium Copper (BeCu)

Paliney® 7 (P7)

Major Specifications

Flat

Semi Radius

Radius

Multi DUT cantilever probe cards can be manufactured in a large variety of configurations including x64, x48 x32, and x16.

Any number of die can be probed along the x axis and is limited only by the available open space on the pc-board. Typically, a maximum of 6 columns of die can be probed along the Y axis.

Using proprietary tip shipping system designed by Apex, we can condition the needle tips to optimize performance. In a recent evaluation at a major memory manufacture, Apex probe cards showed to have significant advantages over the competition.