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Logic Shelf

Logic Shelf cards offer significant improvement over traditional (diagonal) Multi-DUT cards for Logic and mixed signal devices.

The technology for the Shelf card construction is a natural extension of our ceramic ring “block” technology used in our Ultra High parallel cantilever memory cards.

Product Summary

In Shelf card design, the probes remain square to the probe pad and perpendicular to the edge of the die, resulting in more consistent probe force and scrub marks. 

 

Shelf cards are typically configured in 4-DUT (2x2) arrays resulting in more efficient probing patterns.  This can significantly reduces the number of touchdowns required to probe a full wafer.

 

However, Shelf configurations of (1x2), (1x3) and (1x4) arrays are also commonly used and are dependant on die size and the wafer map.

Logic Shelf  (2x2) Total Probes 244

· Probe Array Size:  . . . . . . . .   Typically (2x2), or (1x ?)

· Minimum Pitch:  . . . . . . . . . .  70 μm

· Test Speed: . . . . . . . . . . . . . .  50 MHz

· Alignment: . . . . . . . . . . . . . .  +10μm

· Planarity: . . . . . . . . . . . . . .  . +10μm

· Probe Force: . . . . . . . . . . . . . 1.5 ~ 2.5 g/mil O/T

· Operating Temperature: . . . - 40º ~ 125º C

· Tip Shape: . . . . . . . . . . . . . . . Flat, Semi Radius, Radius

· Probe Material:  . . . . . . . . . . Tungsten (W),

                                                         Tungsten Rhenium (Wre)

                                                          Beryllium Copper (BeCu)

                                                                Paliney® 7 (P7)

Major Specifications